The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Mar. 24, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Junhua Zhang, Shiojiri, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 15/00 (2006.01); B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1629 (2013.01); B41J 2202/22 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1632 (2013.01); B41J 2/1634 (2013.01); B41J 2002/14419 (2013.01);
Abstract
Provided is a manufacturing method of a liquid ejecting head having a flow-path forming substrate in which a liquid flow path is provided to communicate with a nozzle opening through which liquid is discharged. The method includes performing wet etching on both surfaces of the flow-path forming substrate and forming the liquid flow path by removing a burr that is formed when the wet etching is performed on the flow-path forming substrate.