The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Apr. 01, 2013
Union Tool Co., Shinagawa, Tokyo, JP;
Akira Sato, Shinagawa-ku, JP;
Yuji Watanabe, Shinagawa-ku, JP;
Tetsutaro Ohori, Shinagawa-ku, JP;
Shuntaro Suzuki, Shinagawa-ku, JP;
Kazutaka Sato, Shinagawa-ku, JP;
UNION TOOL CO., Tokyo, JP;
Abstract
There is provided a diamond film for cutting-tools which has high toughness, excellent adhesiveness, high hardness, and in which tool service life is considerably improved in relation to cutting ultra-hard alloys and other very hard work materials. A diamond film for cutting-tools formed on a base material, in which at least one or more multilayered film layers [A] are included in which the layers are constituted by layering a film layer [α] having a film thickness of 1 μm or more and 15 μm or less and a film layer [β] having a film thickness of 1 μm or more and 20 μm or less so that the film layer [α] is disposed on the base material side and the film layer [β] is disposed on the surface layer side; the film thickness of the entire film body is set to 4 μm or more and 30 μm or less; and the film layer [α] and the film layer [β] have predetermined film compositions.