The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Jul. 20, 2010
Dae Hyun Kim, Ulsan-si, KR;
Dong Woo Lee, Incheon-si, KR;
IN Dal Kim, Gyeonggi-do, KR;
Sang Young Choi, Seoul, KR;
Ji Hoon Lee, Ulsan-si, KR;
BO Min Jeon, Ulsan-si, KR;
Dae Hyun Kim, Ulsan-si, KR;
Dong Woo Lee, Incheon-si, KR;
In Dal Kim, Gyeonggi-do, KR;
Sang Young Choi, Seoul, KR;
Ji Hoon Lee, Ulsan-si, KR;
Bo Min Jeon, Ulsan-si, KR;
POONGSAN CORPORATION, Seoul, KR;
Abstract
The present invention relates to a method of manufacturing a high purity copper (Cu) powder material useable in fabricating a sputtering target material for electronic industrial applications, for example a penetrator liner. The foregoing method has a configuration of using an apparatus composed of a raw material feeder, a plasma torch and a reactor to prepare a metal powder, and includes steps of passing a Cu powder having an average particle diameter of 30 to 450 μm through the thermal plasma torch at an introduction rate of 2 to 30 kg/hr, to thereby fabricate a Cu powder having an average particle diameter of 5 to 300 μm.