The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Feb. 20, 2013
Applicant:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Aaron R. Cox, Tucson, AZ (US);

Zhen De Fu, Shanghai, CN;

Lei R. Li, Shanghai, CN;

Joni E. Saylor, Phoenix, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01); H05K 3/30 (2006.01); H01R 13/629 (2006.01); H05K 7/14 (2006.01); G06F 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); Y10T 29/49826 (2015.01); Y10T 29/4913 (2015.01); H01R 13/62955 (2013.01); H05K 7/1409 (2013.01); G06F 1/183 (2013.01);
Abstract

An electronic component carrier and method for mounting the electronic component to a circuit board includes a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame. A latching mechanism of the frame includes latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment members. The attachment members are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position. Handling levers extend upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers are substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector.


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