The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Sep. 12, 2012
Applicants:

Kevin Bills, Austin, TX (US);

Mahesh Bohra, Austin, TX (US);

Jinwoo Choi, Austin, TX (US);

Tae Tong Kim, Austin, TX (US);

Rohan Mandrekar, Austin, TX (US);

Inventors:

Kevin Bills, Austin, TX (US);

Mahesh Bohra, Austin, TX (US);

Jinwoo Choi, Austin, TX (US);

Tae Tong Kim, Austin, TX (US);

Rohan Mandrekar, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49151 (2015.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 2224/16 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0231 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/10734 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/16235 (2013.01);
Abstract

A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.


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