The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Aug. 21, 2012
Jian-feng Shiu, Hsinchu County, TW;
Eer-wen Tyan, Hsinchu County, TW;
Ting-kuang Wang, Hsinchu County, TW;
Jian-Feng Shiu, Hsinchu County, TW;
Eer-wen Tyan, Hsinchu County, TW;
Ting-Kuang Wang, Hsinchu County, TW;
MSTAR SEMICONDUCTOR, INC., Hsinchu Hsien, TW;
Abstract
A ball grid array formed on a printed circuit board is provided. The ball grid array includes a first bailout module and a second bailout module. The first bailout module includes a plurality of first solder balls arranged as an array. Two of the first solder balls are grounded, and remaining of the first solder balls are disposed within a shielding area defined by the two grounded first balls. Two among the second solder balls are grounded, and remaining of the second solder balls are disposed within a shielding area of the two grounded second balls. The first and second bailout modules deploy substantially a same bailout arrangement, which is associated with relative positions of the two grounded solder balls and the remaining solder balls that are not grounded in each bailout module.