The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Mar. 15, 2013
Applicant:

Unistars, Hsinchu, TW;

Inventors:

Shin-Shien Shie, Zhongli, TW;

Tien-hao Huang, Zhongli, TW;

Shang-Yi Wu, Hsinchu, TW;

Yi-chun Wu, Miaoli County, TW;

Assignee:

Unistars, Hsinchu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/486 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2224/48091 (2013.01);
Abstract

LED packaging construction includes a substrate, a cavernous construction, a LED, and a reflection layer. The substrate is daubed with an insulation layer and a circuit layer on a surface on the substrate, wherein the substrate is made of metal, and the insulation layer is disposed between the circuit layer and the substrate. The cavernous construction is disposed on the substrate and surrounds the LED, and is formed by disposing a photoresist layer and patterning the photoresist layer. The circuit layer electrically connects the LED through a conducting wire. The reflection layer is at least disposed on a first surface of the cavernous construction, wherein the first surface surrounds the LED and faces toward the LED, and a part of light emitted from the LED is reflected by the reflection layer.


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