The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Jun. 13, 2011
Applicants:

Takamasa Ishii, Honjo, JP;

Masato Inoue, Kumagaya, JP;

Masayoshi Akiyama, Yokohama, JP;

Shinichi Takeda, Honjo, JP;

Satoru Sawada, Fujioka, JP;

Taiki Takei, Okegawa, JP;

Inventors:

Takamasa Ishii, Honjo, JP;

Masato Inoue, Kumagaya, JP;

Masayoshi Akiyama, Yokohama, JP;

Shinichi Takeda, Honjo, JP;

Satoru Sawada, Fujioka, JP;

Taiki Takei, Okegawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); G01T 1/20 (2006.01); H01L 31/18 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0232 (2013.01); G01T 1/2018 (2013.01); H01L 31/18 (2013.01); H01L 27/14618 (2013.01); H01L 27/14663 (2013.01);
Abstract

A radiation image pickup apparatus includes a base, at least one image pickup element, a scintillator, a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element, and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, and in the radiation image pickup element described above, the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.


Find Patent Forward Citations

Loading…