The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Sep. 12, 2012
Applicants:

Juergen Steiger, Taipei, TW;

Duy VU Pham, Oberhausen, DE;

Anita Neumann, Recklinghausen, DE;

Alexey Merkulov, Recklinghausen, DE;

Arne Hoppe, Herne, DE;

Inventors:

Juergen Steiger, Taipei, TW;

Duy Vu Pham, Oberhausen, DE;

Anita Neumann, Recklinghausen, DE;

Alexey Merkulov, Recklinghausen, DE;

Arne Hoppe, Herne, DE;

Assignee:

Evonik Degussa GmbH, Essen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 21/02 (2006.01); C23C 18/12 (2006.01); C23C 18/14 (2006.01); H01L 29/66 (2006.01); H01L 29/24 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78696 (2013.01); H01L 21/02472 (2013.01); H01L 21/02483 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/02614 (2013.01); H01L 21/02628 (2013.01); H01L 29/7869 (2013.01); C23C 18/1208 (2013.01); C23C 18/1225 (2013.01); C23C 18/1279 (2013.01); C23C 18/14 (2013.01); H01L 29/66969 (2013.01); H01L 21/02664 (2013.01); H01L 29/24 (2013.01);
Abstract

The present invention relates to a method for producing a semi-conductor laminate comprising a first and a second metal oxide layer as well as a dielectric layer, wherein the first metal oxide layer is arranged between the second metal oxide layer and the dielectric layer. The first and second metal oxide layers are formed accordingly from a first and a second liquid phase. The present invention also relates to a semi-conductor laminate that can be obtained from such a method, and to electronic components comprising such a semi-conductor laminate.


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