The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jul. 11, 2013
Texas Instruments Incorporated, Dallas, TX (US);
Donald C. Abbott, Norton, MA (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A semiconductor device () includes a leadframe having a chip pad () and a lead () with a first end () proximate to the pad and a second end () remote from the pad, the leadframe having a base metal () including copper and a stack of a plated first layer () of nickel in contact with the base metal and a plated second layer () of a noble metal in contact with the nickel layer, the second lead end free of the noble metal. Further included is a copper wire () having a ball bond () on a semiconductor chip () attached to the chip pad, and a stitch bond () on the proximate lead end, the stitch bond penetrating the second layer; furthermore a packaging compound () encapsulating the chip, the wire, and the first end of the lead, the compound leaving the second end of the lead un-encapsulated; and the unencapsulated second lead end covered with a plated third layer () of solder.