The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Oct. 17, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Michael J. Shapiro, Austin, TX (US);

William F. Van Duyne, San Diego, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/02 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01);
Abstract

Serializer-deserializer (SERDES) and integrated circuit package including a package substrate, first and second SERDES dies having a SERDES circuit, and a logic die having a logic circuit. The SERDES circuit communicatively connected to the package substrate. The first and second SERDES dies positioned adjacent, in a plane, and disposed on the package substrate. The logic circuit communicatively connected to the SERDES circuit and to the package substrate. The logic die stacked vertically and disposed on the first and second SERDES dies. A method of assembling a SERDES and integrated circuit package including providing a SERDES structure selected from a menu of SERDES die and SERDES circuit combinations. A design structure of a SERDES and integrated circuit package including a package substrate, first and second SERDES dies having a SERDES circuit, and a logic die having a logic circuit. The SERDES circuit communicatively connected to the package substrate.


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