The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Oct. 24, 2012
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi-ken, JP;

Inventors:

Masahiro Inoue, Kounan, JP;

Atsuhiko Sugimoto, Kagamigahara, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H05K 1/118 (2013.01); H05K 1/119 (2013.01); H05K 3/34 (2013.01); H05K 2201/09545 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/01322 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/1461 (2013.01);
Abstract

Embodiments of the present invention provide a wiring substrate having a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among a plurality of the projection electrodes is a variant projection electrode which has a recess portion on an upper surface, an outer diameter at the upper end that is larger than an outer diameter at the lower end, and a reverse trapezoidal cross-section shape. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode.


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