The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Aug. 25, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Andre Hanke, Unterhaching, DE;

Oliver Nagy, Vienna, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 49/02 (2006.01); H01L 23/48 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 23/481 (2013.01); H01L 27/0805 (2013.01); H01L 28/91 (2013.01); H01L 28/60 (2013.01); H01L 2924/0002 (2013.01);
Abstract

One or more embodiments relate to a semiconductor device, comprising: A semiconductor device, comprising: a semiconductor substrate; a plurality of first conductive vias, the first conductive vias electrically coupled together, each of the first conductive vias passing through the substrate; and a plurality of second conductive vias, the second conductive vias electrically coupled together, each of the second conductive vias passing through the substrate, the second conductive vias spacedly disposed from the first conductive vias, each of the second conductive vias laterally surrounding a respective one of the first conductive vias.


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