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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9059110 B1

PDFFull Text
Date of Patent:
Jun. 16, 2015

Filed:

Sep. 04, 2009

Reduction of fluorine contamination of bond pads of semiconductor devices

Applicants:

Hyung Sun Yook, Sarawak, MY;

Tsui Ping Chu, Sarawak, MY;

Poh Ching Sim, Sarawak, MY;

Inventors:

Hyung Sun Yook, Sarawak, MY;

Tsui Ping Chu, Sarawak, MY;

Poh Ching Sim, Sarawak, MY;

Assignee:

X-Fab Semiconductor Foundries AG, Erfurt, DE;

Attorneys:

Laurence A. Greenberg

Werner H. Stemer

Ralph E. Locher

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3178 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/85013 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 24/05 (2013.01); H01L 2924/01033 (2013.01);
Abstract

A method of reducing contamination of contact pads in a metallization system of a semiconductor device. Fluorine contamination of contact pads in a semiconductor device can be reduced by appropriately covering the sidewall portions of a metallization system in the scribe lane in order to significantly reduce or suppress the out diffusion of fluorine species, which may react with the exposed surface areas of the contact pads. The quality of the bond contacts is enhanced, possibly without requiring any modifications in terms of design rules and electrical specifications.

Find Patent Forward Citations

Yook, Hyung. (2015). Reduction of fluorine contamination of bond pads of semiconductor devices (U.S. Patent No. 9059110). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9059110

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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