The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Dec. 25, 2012
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Masafumi Horio, Matsumoto, JP;

Kyohei Fukuda, Matsumoto, JP;

Motohito Hori, Matsumoto, JP;

Yoshinari Ikeda, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/34 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/13055 (2013.01); H01L 23/49811 (2013.01); H01L 23/5385 (2013.01); H01L 25/072 (2013.01); H01L 25/074 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/30107 (2013.01); H01L 23/49844 (2013.01); H01L 24/49 (2013.01); H01L 2224/4912 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13062 (2013.01);
Abstract

Semiconductor chips are disposed on an insulating substrate with conductive patterns, and a printed circuit board with metal pins is disposed above the insulating substrate with conductive patterns, with the semiconductor chips therebetween. A plurality of external lead terminals is fixed to the insulating substrate with conductive patterns, with the plurality of external lead terminals disposed adjacent to each other in parallel. Furthermore, metal foil pieces formed on front and rear surfaces of the printed circuit board with metal pins respectively so as to face each other, are disposed above the semiconductor chips.


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