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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9058972 B1

PDFFull Text
Date of Patent:
Jun. 16, 2015

Filed:

Jun. 26, 2014

Semiconductor device, manufacturing method therefor, and electronic apparatus

Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Ikuo Yoshihara, Kanagawa, JP;

Taku Umebayashi, Kanagawa, JP;

Hiroshi Takahashi, Kumamoto, JP;

Hironobu Yoshida, Tokyo, JP;

Assignee:

SONY CORPORATION, , JP;

Attorney:

Sheridan Ross P.C.

Primary Examiner:

David S Blum

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 27/14 (2006.01); H01L 31/00 (2006.01); H01L 21/66 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 27/146 (2006.01); H01L 25/16 (2006.01); H01L 21/762 (2006.01); H01L 23/14 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/00 (2013.01); H01L 21/76251 (2013.01); H01L 23/147 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 25/0657 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 25/167 (2013.01); H01L 25/50 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer.

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