The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Apr. 23, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventor:
Hyun Seok Cho, Seoul, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); F21V 19/00 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
F21V 19/0015 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/85122 (2013.01); H01L 2924/00014 (2013.01); H01L 23/544 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01);
Abstract
Disclosed is a light emitting device package including a reflective substrate including a chip mounting region, a circuit substrate disposed on the reflective substrate, the circuit substrate including an inside edge defining the chip mounting region and at least one aligning hole disposed at a position spaced from the inside edge, and at least one light emitting diode chip disposed in the chip mounting region, the at least one light emitting diode chip being connected to the circuit substrate through a wire.