The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Sep. 10, 2010
Applicants:

Hiroaki Kita, Inazawa, JP;

Kota Shirai, Shizuoka, JP;

Hisakazu Ito, Shizuoka, JP;

Inventors:

Hiroaki Kita, Inazawa, JP;

Kota Shirai, Shizuoka, JP;

Hisakazu Ito, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 21/06 (2006.01); C22C 21/00 (2006.01); B32B 3/00 (2006.01); C25D 11/16 (2006.01); B29C 33/38 (2006.01);
U.S. Cl.
CPC ...
C25D 11/16 (2013.01); Y10T 428/24479 (2015.01); B29C 33/38 (2013.01); B29K 2905/02 (2013.01); C22C 21/06 (2013.01);
Abstract

The present invention relates to an aluminum die base material for a stamper having a component composition that contains 0.5% by weight to 3.0% by weight of Mg, the total amount of elements other than Mg, including unavoidable impurities, is 500 ppm or less, and the remainder is composed of Al, and a forged structure in which the average crystal grain size is 1000 μm or less and the surface area ratio of second phase particles is 0.10% or less. According to the present application, a stamper can be provided in which, together with the crystal grain size of the aluminum being refined, the formation of second phase particles is inhibited, surface irregularities attributable to mirrored surface polishing are reduced, and a uniform relief pattern is formed by anodic oxidation treatment.


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