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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9057132 B1

PDFFull Text
Date of Patent:
Jun. 16, 2015

Filed:

Nov. 20, 2012

Primer composition

Applicant:

Sumitomo Metal Mining Co., Ltd., Tokyo, JP;

Inventors:

Hidetoshi Yamabe, Ichikawa, JP;

Yuka Takita, Ichikawa, JP;

Kyouko Miyauchi, Ichikawa, JP;

Assignee:

SUMITOMO METAL MINING CO., LTD., Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C09D 163/02 (2006.01); C09D 163/04 (2006.01); C08K 3/36 (2006.01); C08K 9/00 (2006.01); C23C 22/02 (2006.01); C09D 5/00 (2006.01); C09D 7/12 (2006.01); C09D 163/00 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); B32B 15/092 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
C23C 22/02 (2013.01); C09D 5/00 (2013.01); C09D 7/12 (2013.01); C09D 163/04 (2013.01); C09D 5/002 (2013.01); C09D 7/1266 (2013.01); C08G 59/38 (2013.01); C08G 59/4021 (2013.01); C09D 163/00 (2013.01); C08K 2201/003 (2013.01);
Abstract

Disclosed herein is a primer composition capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various materials that may be bonded with an epoxy-based adhesive. The primer composition includes: an epoxy resin containing at least a bisphenol A-type epoxy resin and a phenol novolac-type epoxy resin; a curing agent being dicyandiamide; a curing catalyst being imidazole; and an inorganic oxide filler containing fumed silica, at least a surface of which is hydrophobic and which has a primary particle diameter of 7 to 40 nm and a specific surface area of 50 to 380 m/g, in an amount of 0.5 to 3 parts by weight per 100 parts by weight of the total amount of the epoxy resins, wherein the primer composition includes no solvent.

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