The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Feb. 16, 2005
Toshihiro Tai, Osaka, JP;
Weihong Gu, Hyogo, JP;
Tatsuo Izumitani, Hyogo, JP;
DAICEL POLYMER LTD., Tokyo, JP;
DAICEL CHEMICAL INDUSTRIES, LTD., Sakai-shi, Osaka, JP;
Abstract
The present invention provides a plated resin molded article having a high adhering strength of a plating layer. Specifically, it provides a plated resin molded article that has a metal plating layer on the surface of a thermoplastic resin molded article comprising a composition that contains (A) 10 to 90 mass % of a matrix resin that has a water absorption after 24 hours in 23° C. water (ISO62) of at least 0.6% and (B) 90 to 10 mass % of a non-styrenic resin that has a water absorption after 24 hours in 23° C. water (ISO62) of less than 0.6%, wherein the thermoplastic resin molded article is not subjected to etching with a heavy metal-containing acid.