The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9055704 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 09, 2015

Filed:

Dec. 19, 2011
Applicants:

Kouji Kose, Yamakita, JP;

Kouta Togawa, Hadano, JP;

Katsuro Kawazoe, Hadano, JP;

Takayoshi Kojima, Hadano, JP;

Inventors:

Kouji Kose, Yamakita, JP;

Kouta Togawa, Hadano, JP;

Katsuro Kawazoe, Hadano, JP;

Takayoshi Kojima, Hadano, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B30B 7/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4638 (2013.01);
Abstract

A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.


Find Patent Forward Citations

Kose, Kouji. (2015). Hot press device and multi-layered printed board press method (U.S. Patent No. 9055704). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9055704

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