The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Aug. 11, 2009
Applicants:
Mark Robson Humphries, Essex, GB;
Frank Ferdinandi, Cambridge, GB;
Rodney Edward Smith, Essex, GB;
Inventors:
Assignee:
Semblant Limited, London, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01); H01H 13/78 (2006.01); H05K 3/22 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/282 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01H 13/78 (2013.01); H01H 2215/004 (2013.01); H01H 2229/012 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45105 (2013.01); H01L 2224/45109 (2013.01); H01L 2224/45111 (2013.01); H01L 2224/45113 (2013.01); H01L 2224/45116 (2013.01); H01L 2224/4512 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45149 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/45157 (2013.01); H01L 2224/4516 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45166 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/4517 (2013.01); H01L 2224/45171 (2013.01); H01L 2224/45173 (2013.01); H01L 2224/45178 (2013.01); H01L 2224/4518 (2013.01); H01L 2224/45184 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45599 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/85201 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/2075 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/3011 (2013.01); H05K 3/222 (2013.01); H05K 3/284 (2013.01); H05K 3/328 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/049 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01087 (2013.01); H01L 2224/8502 (2013.01);
Abstract
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.