The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Jul. 17, 2012
Applicant:

David J. Lima, Los Altos, CA (US);

Inventor:

David J. Lima, Los Altos, CA (US);

Assignee:

Juniper Networks, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 13/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20418 (2013.01); Y10T 29/49117 (2015.01); H05K 7/205 (2013.01); H05K 1/0209 (2013.01); H05K 1/0204 (2013.01);
Abstract

In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or 'pluggable') optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.


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