The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

May. 24, 2013
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Mamoru Kurashina, Atsugi, JP;

Daisuke Mizutani, Sagamihara, JP;

Taiga Fukumori, Isehara, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); Y10T 29/49126 (2013.01); H05K 1/024 (2013.01); H05K 1/147 (2013.01); H05K 3/3436 (2013.01); H05K 3/363 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2009 (2013.01); H05K 3/4697 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01);
Abstract

An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.


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