The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Sep. 19, 2013
Applicants:

Lawrence T. Clark, Phoenix, AZ (US);

Sandeep Shambhulingaiah, Tempe, AZ (US);

Sushil Kumar, Tempe, AZ (US);

Chandarasekaran Ramamurthy, Tempe, AZ (US);

Inventors:

Lawrence T. Clark, Phoenix, AZ (US);

Sandeep Shambhulingaiah, Tempe, AZ (US);

Sushil Kumar, Tempe, AZ (US);

Chandarasekaran Ramamurthy, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 3/289 (2006.01); H03K 3/356 (2006.01); G06F 17/50 (2006.01); H03K 3/037 (2006.01); H03K 3/3562 (2006.01);
U.S. Cl.
CPC ...
H03K 3/356086 (2013.01); G06F 17/5072 (2013.01); G06F 2217/70 (2013.01); H03K 3/0375 (2013.01); H03K 3/35606 (2013.01); H03K 3/35625 (2013.01);
Abstract

This disclosure relates generally to sequential state elements (SSEs). More specifically, embodiments of flip-flops are disclosed, along with computerized methods and systems of designing the same. In one embodiment, the flip-flop includes a substrate and subcircuits that are formed on the substrate. The subcircuits provide subfunctions, wherein each of the subcircuits provides at least one of the subfunctions. More specifically, the subfunctions are provided in a sequential logical order by the subcircuits so that the flip-flop provides a flip-flop function. However, the subcircuits are interleaved out of the sequential logical order with respect to a corresponding subfunction provided by each of the subcircuits along a vector defined by the substrate. In this manner, interleaving the subcircuits along the vector of the substrate can provide separation between charge collection nodes without requiring increases in size. Thus, the flip-flop can be more compact and less expensive to manufacture.


Find Patent Forward Citations

Clark, Lawrence. (2015). Sequential state elements radiation hardened by design (U.S. Patent No. 9054688). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9054688

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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