The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Apr. 04, 2012
Applicant:
Akihiro Matsusue, Nagasaki, JP;
Inventor:
Akihiro Matsusue, Nagasaki, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/026 (2006.01); H01S 5/042 (2006.01); H01L 31/12 (2006.01); H01S 5/022 (2006.01); H01S 5/062 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0262 (2013.01); H01S 5/02212 (2013.01); H01S 5/02236 (2013.01); H01S 5/02248 (2013.01); H01S 5/02276 (2013.01); H01S 5/0427 (2013.01); H01S 5/06226 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48091 (2013.01); H01L 31/12 (2013.01);
Abstract
A wiring is located on a multilayer ceramic substrate. A ceramic block is located on the multilayer ceramic substrate. Electronic parts, including a semiconductor laser, are located on a surface of the ceramic block. A wiring located on the surface of the ceramic block connects some of the electronic parts to the wiring. A metallic cap with a glass window is located on the multilayer ceramic substrate. This metallic cap covers the ceramic block and the electronic parts, including the semiconductor laser.