The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

May. 25, 2011
Applicants:

Jan Hesse, Dresden, DE;

Christian Kirchhof, Dresden, DE;

Udo Bechtloff, Mittweida, DE;

Kai Schmieder, Dresden, DE;

Inventors:

Jan Hesse, Dresden, DE;

Christian Kirchhof, Dresden, DE;

Udo Bechtloff, Mittweida, DE;

Kai Schmieder, Dresden, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 1/62 (2006.01); H01L 51/52 (2006.01); H05K 3/32 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5203 (2013.01); H01L 51/5243 (2013.01); H01L 2251/5361 (2013.01); H05K 1/112 (2013.01); H05K 3/321 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09363 (2013.01); H05K 2201/10106 (2013.01);
Abstract

The invention relates to a lighting element, wherein at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. In the lighting element in accordance with the invention, at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. The at least one organic light-emitting diode and the substrate are connected to a circuit board and electric contact elements for the connection of the electrodes of the organic light-emitting diode(s) are present at the surface of the circuit board. The surface of the circuit board facing in the direction of the organic light-emitting diode(s) is provided over its full area with a metallic coating as a permeation barrier. The metallic coating is only breached by electric insulators formed about the contact elements.


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