The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Apr. 20, 2014
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Tsai-Yu Chen, Kaohsiung, TW;

Chun-Wei Wang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/58 (2010.01); H01L 27/15 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/46 (2010.01); H01L 33/44 (2010.01); H01L 33/54 (2010.01); H01L 33/52 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 27/15 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/46 (2013.01); H01L 33/44 (2013.01); H01L 33/54 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01);
Abstract

A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.


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