The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Apr. 09, 2014
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Chia-En Lee, Chiayi, TW;

Cheng-Hung Chen, Hsinchu, TW;

Li-Chuan Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/42 (2010.01); H01L 33/38 (2010.01); H01L 23/00 (2006.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/42 (2013.01); H01L 33/62 (2013.01); H01L 33/20 (2013.01); H01L 33/385 (2013.01); H01L 24/13 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13339 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A light-emitting diode (LED) with a bump structure on a sidewall is provided. The LED comprises a substrate, an epitaxial structure, a first conductive bump, a second conductive bump, a first extended electrode and a second extended electrode. The substrate has a top surface, a first side surface and an inclined surface between the top surface and the first side surface. The epitaxial structure is disposed on the top surface of the substrate, and comprises a N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer, a transparent conductive layer, a P-electrode and a N-electrode. The first extended electrode and the second extended electrode connect the P-electrode and the N-electrode, extend through the inclined surface, and are electrically connected to the first and the second conductive bumps, respectively. A mounting structure comprises said LED, a sub-mount and a connector mounting the LED onto the sub-mount.


Find Patent Forward Citations

Loading…