The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Nov. 22, 2011
Applicants:

Stefan Braun, Reutlingen, DE;

Frank Niklaus, Täby, SE;

Andreas Fischer, Johanneshov, SE;

Henrik Gradin, Sollentuna, SE;

Inventors:

Stefan Braun, Reutlingen, DE;

Frank Niklaus, Täby, SE;

Andreas Fischer, Johanneshov, SE;

Henrik Gradin, Sollentuna, SE;

Assignee:

SENSEAIR AB, Delsbo, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85345 (2013.01); H01L 2224/85385 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/10253 (2013.01); B23K 20/007 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/858 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/45 (2013.01); H01L 2224/85099 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/1461 (2013.01);
Abstract

The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.


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