The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Apr. 15, 2011
Applicants:

Robert L. Bruce, White Plains, NY (US);

Qinghuang Lin, Yorktown Heights, NY (US);

Alshakim Nelson, San Carlos, CA (US);

Satyanarayana V. Nitta, Poughquag, NY (US);

Dirk Pfeiffer, Croton on Hudson, NY (US);

Jitendra S. Rathore, Campbelle, CA (US);

Inventors:

Robert L. Bruce, White Plains, NY (US);

Qinghuang Lin, Yorktown Heights, NY (US);

Alshakim Nelson, San Carlos, CA (US);

Satyanarayana V. Nitta, Poughquag, NY (US);

Dirk Pfeiffer, Croton on Hudson, NY (US);

Jitendra S. Rathore, Campbelle, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76832 (2013.01); H01L 23/5222 (2013.01); H01L 23/5329 (2013.01); H01L 23/53295 (2013.01); H01L 21/76801 (2013.01); H01L 21/76804 (2013.01); H01L 21/76808 (2013.01); H01L 21/7682 (2013.01); H01L 21/76825 (2013.01); H01L 21/76826 (2013.01); H01L 21/76828 (2013.01); H01L 21/76835 (2013.01); H01L 2221/1031 (2013.01);
Abstract

An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region.


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