The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Apr. 07, 2009
Applicants:

Jianwen Xu, Chandler, AZ (US);

Lizabeth Ann A. Keser, Chandler, AZ (US);

Goerge R. Leal, Cedar Park, TX (US);

Betty H. Yeung, Chandler, AZ (US);

Inventors:

Jianwen Xu, Chandler, AZ (US);

Lizabeth Ann A. Keser, Chandler, AZ (US);

Goerge R. Leal, Cedar Park, TX (US);

Betty H. Yeung, Chandler, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 23/562 (2013.01); H01L 24/00 (2013.01); H01L 24/19 (2013.01); H01L 24/97 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01076 (2013.01);
Abstract

An electronic device can include a package device structure including a die encapsulated within a packaging material. The package device structure can have a first side and a second side opposite the first side. The electronic device can include a first layer along the first side of the package device structure. The first layer can be capable of causing a first deformation of the package device structure. The electronic device can also include a second layer along the second side of the package device structure. The second layer can be capable of causing a second deformation of the package device structure, the second deformation opposite the first deformation.


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