The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Mar. 26, 2012
Applicants:

Kazuo Tomita, Kawasaki, JP;

Toshiyuki Oashi, Kawasaki, JP;

Hidenori Sato, Kawasaki, JP;

Inventors:

Kazuo Tomita, Kawasaki, JP;

Toshiyuki Oashi, Kawasaki, JP;

Hidenori Sato, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 27/02 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 23/52 (2013.01); H01L 27/0207 (2013.01); H01L 21/823871 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A gate interconnection portion includes a first gate interconnection portion, a second gate interconnection portion, and a third gate interconnection portion. The first gate interconnection portion is formed in parallel to a Y axis direction toward a power supply interconnection and extends to a prescribed position within an element formation region. The second gate interconnection portion is formed in parallel to a direction obliquely bent with respect to the Y-axis direction from the first gate interconnection portion toward the power supply interconnection, and extends across a boundary between the element formation region and an element isolation insulating film, which is in parallel to an X axis direction. The third gate interconnection portion further extends in parallel to the Y-axis direction from the second gate interconnection portion toward the power supply interconnection.


Find Patent Forward Citations

Loading…