The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Jun. 19, 2013
Applicant:
Lsi Corporation, Milpitas, CA (US);
Inventors:
Mark A Bachman, Sinking Spring, PA (US);
John W Osenbach, Kutztown, PA (US);
Sailesh M Merchant, Macungie, PA (US);
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/3128 (2013.01); H01L 23/3677 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01019 (2013.01); H05K 1/0201 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/05025 (2013.01);
Abstract
A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.