The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Feb. 13, 2012
Applicants:
Fei Yu, Santa Clara, CA (US);
Qi Deng, San Jose, CA (US);
Assignee:
Futurewei Technologies, Inc., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/16 (2006.01); H01L 21/02 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/02365 (2013.01); G02B 6/4214 (2013.01); H01L 2224/16 (2013.01); G02B 6/428 (2013.01); G02B 6/4246 (2013.01);
Abstract
An integrated circuit package includes a substrate having a recess formed along at least a portion of a perimeter of the substrate, and an optical die having opto-electric circuitry, the optical die coupled to the substrate such that a portion of the optical die with the opto-electric circuitry overhangs the recess. The integrated circuit package also includes an optical unit disposed in the recess such that optical signals emitted by the opto-electric circuitry are reflected away from the substrate and incident optical signals are reflected onto the opto-electric circuitry.