The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Mar. 03, 2014
Applicant:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Inventors:

Bunji Yasumura, Kanagawa, JP;

Yoshinori Deguchi, Kanagawa, JP;

Fumikazu Takei, Kanagawa, JP;

Akio Hasebe, Kanagawa, JP;

Naohiro Makihira, Kanagawa, JP;

Mitsuyuki Kubo, Kanagawa, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 25/065 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 22/14 (2013.01); H01L 23/544 (2013.01);
Abstract

To improve the assemblability of a semiconductor device. When a memory chip is mounted over a logic chip, a recognition range including a recognition mark formed at a back surface of the logic chip is imaged and a shape of the recognition range is recognized, alignment of a plurality of bumps of the logic chip and a plurality of projection electrodes of the above-described memory chip is performed based on a result of the recognition, and the above-described memory chip is mounted over the logic chip. At this time, the shape of the recognition range is different from any portion of an array shape of the bumps, as a result, the recognition mark in the shape of the recognition range can be reliably recognized, and alignment of the bumps of the logic chip and the projection electrodes of the above-described memory chip is performed with high accuracy.


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