The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

May. 28, 2014
Applicant:

Jinwoo Choi, Austin, TX (US);

Inventor:

Jinwoo Choi, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 23/15 (2006.01); H05K 3/46 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5077 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/0224 (2013.01); H05K 2201/09681 (2013.01); H05K 3/4629 (2013.01); H01L 23/15 (2013.01); H01L 23/50 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0225 (2013.01); G06F 2217/82 (2013.01);
Abstract

An improved multi-layered ceramic package includes a plurality of signal planes, each having one or more signal lines; a plurality of vias, each providing one of a voltage (Vdd) power connection or a ground (Gnd) connection; and at least one reference mesh plane adjacent to one or more signal planes. The reference mesh plane includes spaced mesh lines that are separated by spaces that alternate in a narrow-wide or wide-narrow pattern. A multi-layered ceramic package, using the mesh plane with alternating spaces, generates significantly lower far-end (FE) noise in the ceramic package than a conventional mesh plane with constant spaces. The noise is further reduced by placing shield lines on opposite sides of signal lines in the signal plane. A method, computer system, and program code that generate the design for the multi-layered ceramic package are also disclosed.


Find Patent Forward Citations

Loading…