The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Oct. 10, 2012
Applicant:

Fujitsu Limited, Kawasaki-shi, JP;

Inventors:

Hiroshi Kobayashi, Kawasaki, JP;

Satoshi Emoto, Nagano, JP;

Toru Okada, Yokohama, JP;

Masayuki Kitajima, Yokohama, JP;

Takumi Masuyama, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5009 (2013.01); H01L 24/10 (2013.01); H05K 1/0271 (2013.01); H05K 3/0005 (2013.01); G06F 17/5086 (2013.01);
Abstract

A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.


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