The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Aug. 07, 2012
Applicants:

Kerry Bernstein, Underhill, VT (US);

Kenneth J. Goodnow, Essex Junction, VT (US);

Clarence R. Ogilvie, Huntington, VT (US);

Inventors:

Kerry Bernstein, Underhill, VT (US);

Kenneth J. Goodnow, Essex Junction, VT (US);

Clarence R. Ogilvie, Huntington, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); G05D 23/00 (2006.01); G05D 23/19 (2006.01); H01L 23/38 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G05D 23/1919 (2013.01); G06F 1/206 (2013.01); H05K 7/20518 (2013.01); H05K 7/20281 (2013.01); H05K 7/20272 (2013.01); H01L 23/38 (2013.01); H01L 23/473 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1305 (2013.01);
Abstract

An integrated circuit chip having micro-channels formed in multiple regions of the integrated circuit chip and a method of cooling the integrated circuit chip. The method includes for any region of the multiple regions, allowing a coolant to flow through micro-channels of the region only when a temperature of the region exceed a first specified temperature and blocking the coolant from flowing through the micro-channels of the region when a temperature of the region is below a second specified temperature.


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