The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Mar. 21, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Yoon-chul Son, Hwaseong-si, KR;

Dong-earn Kim, Seoul, KR;

Dong-ouk Kim, Pyeongtaek-si, KR;

Ha-jin Kim, Hwaseong-si, KR;

Sung-hoon Park, Seoul, KR;

Min-jong Bae, Yongin-si, KR;

Sang-eui Lee, Hwaseong-si, KR;

Kun-mo Chu, Seoul, KR;

In-taek Han, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01); H05B 3/12 (2006.01); H05B 3/36 (2006.01); H05B 3/14 (2006.01); H05B 3/38 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2064 (2013.01); H05B 3/12 (2013.01); H05B 3/36 (2013.01); G03G 15/2057 (2013.01); H05B 3/146 (2013.01); H05B 3/38 (2013.01);
Abstract

A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.


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