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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9051454 B1

PDFFull Text
Date of Patent:
Jun. 09, 2015

Filed:

Dec. 08, 2011

Heat-resistant polyamide composition and application thereof

Applicants:

Qingfeng Yi, Guangdong, CN;

Sujun Jiang, Guangdong, CN;

Jiehong Mai, Guangdong, CN;

Zhingqiang Jiang, Guangdong, CN;

Jieming Long, Guangdong, CN;

Xia Yan, Guangdong, CN;

Kaijun Ning, Guangdong, CN;

Tongmin Cai, Guangdong, CN;

Inventors:

Qingfeng Yi, Guangdong, CN;

Sujun Jiang, Guangdong, CN;

Jiehong Mai, Guangdong, CN;

Zhingqiang Jiang, Guangdong, CN;

Jieming Long, Guangdong, CN;

Xia Yan, Guangdong, CN;

Kaijun Ning, Guangdong, CN;

Tongmin Cai, Guangdong, CN;

Assignees:

KINGFA SCI & TECH CO. LTD., , CN;

SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD, , CN;

Attorneys:

Lucas & Mercanti, LLP

Peter J. Phillips

Primary Examiner:

Kriellion Sanders

Int. Cl.
CPC ...
C08K 3/00 (2006.01); C08K 3/02 (2006.01); C08K 3/18 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 3/40 (2006.01); C08K 5/00 (2006.01); C08K 5/04 (2006.01); C08K 5/07 (2006.01); C08K 5/13 (2006.01); C08K 5/36 (2006.01); C08K 5/52 (2006.01); C08K 13/04 (2006.01); C08L 77/06 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
C08K 13/04 (2013.01); C08L 77/06 (2013.01); H01L 33/60 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/2296 (2013.01);
Abstract

The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition. The heat-resistant polyamide composition not only has high initial whiteness, high reflectivity and excellent heat resistance, but also has good moldability and good dimensional stability; therefore, the heat-resistant polyamide composition is capable of being applied for preparing the reflecting supports for such light sources as LCD backlight of portable phones, computers, televisions and the like, as well as headlights of automotive vehicles, instrument panels and lighting appliances, etc.

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