The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Jan. 10, 2013
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Tatsuya Ganbe, Asaka, JP;

Yuji Takematsu, Hino, JP;

Kenji Okamoto, Hachioiji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/22 (2006.01); H01L 21/00 (2006.01); C08K 3/36 (2006.01); H01L 31/0216 (2014.01); C08G 59/32 (2006.01); C08K 3/00 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 31/0203 (2014.01); H01L 31/048 (2014.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); H01L 31/0216 (2013.01); C08G 59/32 (2013.01); C08K 3/0033 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08L 63/00 (2013.01); H01L 23/295 (2013.01); H01L 23/3107 (2013.01); H01L 21/561 (2013.01); H01L 23/291 (2013.01); H01L 31/0203 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/45124 (2013.01); H01L 31/048 (2013.01); H01L 2924/13055 (2013.01); Y02E 10/50 (2013.01); H01L 2924/1305 (2013.01);
Abstract

A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.


Find Patent Forward Citations

Ganbe, Tatsuya. (2015). Resin composition (U.S. Patent No. 9051450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9051450

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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