The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Sep. 07, 2010
Applicants:

Hiroshi Mase, Kisarazu, JP;

Koji Hirota, Miura-gun, JP;

Inventors:

Hiroshi Mase, Kisarazu, JP;

Koji Hirota, Miura-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/06 (2006.01); B32B 15/08 (2006.01); B32B 15/12 (2006.01); B32B 27/06 (2006.01); B32B 29/06 (2006.01); B32B 3/02 (2006.01); C23C 14/24 (2006.01); A61L 15/46 (2006.01); A61L 15/18 (2006.01); C22C 9/02 (2006.01); C23C 14/20 (2006.01); A01N 59/20 (2006.01);
U.S. Cl.
CPC ...
A61L 15/46 (2013.01); Y10T 428/265 (2015.01); Y10T 428/2958 (2015.01); Y10T 428/239 (2015.01); A61L 15/18 (2013.01); A61L 2300/102 (2013.01); A61L 2300/404 (2013.01); C22C 9/02 (2013.01); C23C 14/20 (2013.01); A01N 59/20 (2013.01);
Abstract

Provided is an antimicrobial raw material having excellent antibacterial and corrosion-resistance properties, which can be directly formed as a film even on a plastic substrate with low heat-resistance or a substrate whereof the color or properties are likely to change due to heat, and this can be achieved at relatively low cost. The antimicrobial raw material is a laminated structure which comprises a substrate layer and a copper-tin alloy layer disposed on the substrate layer, and which has a thickness ranging from 5 nm to 200 nm. The substrate layer is made of resin, natural fiber, or paper, the resin having the deflection temperature under load being 115° C. or lower when measured in accordance with ASTM-D648-56 under a load of 1820 kPa. The copper-tin alloy layer contains over 60 at % but no more than 90 at % of copper and 10 at % or more but less than 40 at % of tin.


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