The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Mar. 30, 2011
Yoshihiro Morita, Kawasaki, JP;
Takahiro Ooi, Kawasaki, JP;
Tetsuro Yamada, Kawasaki, JP;
Akiko Matsui, Kawasaki, JP;
Mitsuhiko Sugane, Kawasaki, JP;
Takahide Mukoyama, Kawasaki, JP;
Yoshihiro Morita, Kawasaki, JP;
Takahiro Ooi, Kawasaki, JP;
Tetsuro Yamada, Kawasaki, JP;
Akiko Matsui, Kawasaki, JP;
Mitsuhiko Sugane, Kawasaki, JP;
Takahide Mukoyama, Kawasaki, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.