The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Jun. 07, 2013
Applicant:
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;
Inventors:
Dror Hurwitz, Zhuhai, CN;
Alex Huang, Zhuhai, CN;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H01L 24/81 (2013.01); H05K 1/115 (2013.01); H05K 3/0082 (2013.01);
Abstract
A method of attaching a chip to the substrate with an outer layer consisting of via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the method consisting of optionally removing an organic varnish, positioning a chip having legs terminated with solder bumps in contact with exposed ends of the via pillars, and applying heat to melt the solder bumps and to wet the ends of the vias with solder.