The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Mar. 19, 2012
Applicants:
You-jin Kyung, Daejeon, KR;
Hee-jung Kim, Daejeon, KR;
Kwang-joo Lee, Daejeon, KR;
Jung-hak Kim, Daejeon, KR;
Inventors:
You-Jin Kyung, Daejeon, KR;
Hee-Jung Kim, Daejeon, KR;
Kwang-Joo Lee, Daejeon, KR;
Jung-Hak Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 3/28 (2006.01); C08F 2/46 (2006.01); C08G 61/04 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01); C09D 179/08 (2006.01); G03F 7/031 (2006.01); G03F 7/037 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0076 (2013.01); H05K 3/287 (2013.01); C08G 73/1046 (2013.01); C08G 73/105 (2013.01); C08L 79/08 (2013.01); C09D 179/08 (2013.01); G03F 7/031 (2013.01); G03F 7/037 (2013.01);
Abstract
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.