The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Mar. 14, 2013
Applicants:
Jae-jin Park, Seongnam-si, KR;
Hee-seok Lee, Yongin-si, KR;
Ji-hwan Hyun, Daegu, KR;
Kang-yeop Choo, Suwon-si, KR;
Inventors:
Jae-Jin Park, Seongnam-si, KR;
Hee-Seok Lee, Yongin-si, KR;
Ji-Hwan Hyun, Daegu, KR;
Kang-Yeop Choo, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0542 (2013.01); H03H 9/0547 (2013.01); H03H 9/1014 (2013.01);
Abstract
A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal.