The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Oct. 25, 2010
Applicant:

Yoshifumi Shinmi, Makinohara, KP;

Inventor:

Yoshifumi Shinmi, Makinohara, KP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/10 (2006.01); H01R 43/048 (2006.01); H01R 4/18 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01R 4/188 (2013.01); H01R 4/184 (2013.01);
Abstract

An object of the invention is to improve electrical connection performance by increasing a pressure of contact between an electric wire and a terminal. A conductor press bond part () of a terminal is formed in substantially a U-shaped cross section opened upward by a base plate (A) and a pair of conductor crimp pieces (B,B) extended upward from both right and left lateral edges of the base plate (A). A range from the base plate (A) to the root of the pair of conductor crimp pieces (B,B) is formed as a curved wall (H) with substantially a circular arc shape, and when a radius of curvature of an inner surface of the curved wall (H) is R and a radius of a conductor of the electric wire is r, the curved wall is set so as to satisfy R<r. In the case of pressing and bonding this terminal to the electric wire, the conductor (Wa) of the electric wire is inserted between the pair of conductor crimp pieces (B,B) and by a press bond operation of a lower mold () and an upper mold () of a press bond device in its insertion state, the pair of conductor crimp pieces (B,B) is inward rounded to be crimped so as to wrap the conductor (Wa) with the base plate (A).


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