The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Dec. 06, 2011
Applicants:

Yuji Naito, Kanagawa, JP;

Mitsuhiro Tomita, Kanagawa, JP;

Inventors:

Yuji Naito, Kanagawa, JP;

Mitsuhiro Tomita, Kanagawa, JP;

Assignee:

Molex Incorporated, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01); H01R 13/00 (2006.01); G06F 1/20 (2006.01); H01R 12/71 (2011.01); H01R 13/506 (2006.01);
U.S. Cl.
CPC ...
H01R 13/00 (2013.01); G06F 1/20 (2013.01); H01R 12/712 (2013.01); H01R 13/506 (2013.01);
Abstract

A card connector that includes a housing that houses a card provided with a terminal member, a connecting terminal attached to the housing that connects with the terminal member of the card, a cover member connected to the housing and which forms a card housing space between the housing, a card connector attached to a substrate. The cover member includes a top panel part, a plurality of side panel parts established from the side edge of the top panel part, and a fixed side that extends from the bottom end edge of the side panel part. At least one of the fixed sides is connected to a heat transfer pad arranged on the substrate. The top panel part contacts the top surface of the card housed within the card housing space and is provided with a heat transfer improving part that improves heat transfer from the card to the top panel part.


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