The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

May. 28, 2010
Applicants:

Michael Zitzlsperger, Regensburg, DE;

Eckhard Ditzel, Linsengericht, DE;

Jörg Erich Sorg, Regensburg, DE;

Inventors:

Michael Zitzlsperger, Regensburg, DE;

Eckhard Ditzel, Linsengericht, DE;

Jörg Erich Sorg, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/38 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.


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